NEMST-Waterfall2008III series

Atmospheric Plasma Cleaner_RF_Waterfall Type

Dielectric Barrier Discharge (DBD) Plasma Electrodes
Design With High Plasma Density
Direct Plasma Design with Single Electrode (Air-Cooling)
Using Ar for Reaction Gas. Electrode width can be designed based on customers' requirements
Electrodes can be expanded with higher treatment speed
Gap between Electrode and Substrate is about 1 ~ 4 mm
Can be Sheet by Sheet or Reel-to-Reel treatment
Can be standalone machine or module integrated with in-line mechanism

Single Side Treatment. Reaction Gases: Ar (Low Gas Rate Needed)
Gap Between Electrode and Substrate can enlarged to 4~5 mm
Plasma Effective Width: 100 mm ~ 1000 mm (Can be larger based on customers' requirements)
Treatment Speed: 0.5 ~ 5 m / min in general (Can be changed based on customers' requirements)
Suitable for various materials with sheet or film forms
High Plasma Treatment Stability and Uniformity

PCB & Substrate Technologies: Surface cleaning and modification of various PCBs (activation and roughness improvement), suitable for gold/copper plating or pre-shipment treatment, FCCL
Display & Glass Craftsmanship: Surface cleaning and modification of bare/ITO glass substrates (e.g., hydrophilicity improvement), LCD or sensor cleaning in TP processes, glass industry
Optics & Color Filter Processes: Panel cleaning in CF processes (pre-BM and RGB photoresist), cost-effective and high-efficiency replacement for traditional UV-Ozone cleaners
General Materials & Film Applications: Surface cleaning and modification for various electronic/non-electronic components and materials (PI, PET, PE, plastics, etc.), thin film industry

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